New SMT Equipment: dewetting immersion gold (Page 1 of 8)

Double sided immersion gold pcb

New Equipment |  

Our company professionally manufacture products are both excellent in quality and reasonable in price! Our products had been approved by UL and certificated for ROHS compliance. Our quality system had been certificated and met the requirements of ISO

OKE PCB Production Co.,Ltd

4 layer pcb Immersion gold

4 layer pcb Immersion gold

New Equipment | Printing

Base material: FR4 Layer count: four layer Board thickness: 1.6mm Copper thickness: 2 oz Surface finish: Immersion Gold Solder mask color: Green Sizes: 262 x 185/1up

Shenzhen Aobo Technology Co.,Ltd

4 layer pcb Immersion gold

4 layer pcb Immersion gold

New Equipment | Printing

Base Material: FR4 Layer count: four layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: Immersion Gold Soldermask Colors: blue

Shenzhen Aobo Technology Co.,Ltd

8 layer inmmersion gold board

8 layer inmmersion gold board

New Equipment | Components

8 layers board Basic Material: FR-4 Board Ply (thickness): 1.80mm Measurement: 254mm x 304.8mm Conductor Width: 5mil (0.13mm) Conductor Spacing: 5mil (0.13mm) Surface Treatment: Immersion gold File Format: Gerber File (RS274X) Through Hole: 2

Headpcb

Immersion-Gold-4-Layers-PCB

Immersion-Gold-4-Layers-PCB

New Equipment |  

FR4 1. 2 mm 4layer 1/1/1/1oz, Immersion Gold e-test

Shenzhen Longkun Technology Co.,Ltd

Printed Circuit Board

Printed Circuit Board

New Equipment | Printing

Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ M

Multycircuit Technology Limited

2 Layer FPC

2 Layer FPC

New Equipment | Components

Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/OD

Headpcb

10 Layer Gold fingers PCB

10 Layer Gold fingers PCB

New Equipment | Components

Layer: 10L Base Material:FR-4 tg180(ITEQ) Board Thickness: 1.6mm Final copper: 35um Surface Finish:Immersion Gold/Au:2u” min. Gold fingers/Au:30u” Solder mask: Green Profile: Routing E-test: 100% Fixture Quality report: Solderability test, Fi

Headpcb

Power PCB

Power PCB

New Equipment | Design Services

Layer:4 Material:FR-4 4/4/4/4oz Thickness:2.0 Minimum hole:0.35mm Minimum Tracc/Spacing:12mil/15mil Application:power supply Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:  

Multycircuit Technology Limited

Rigid PCB

Rigid PCB

New Equipment | Materials

Layer: 2 Material: FR-4 Board Thickness: 1.6mm Surface Finish: HAL Copper Thickness: 2/2 oz Green Solder Mask Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness:  0.5OZ-13OZ Min line width/space:   3mil/3mil Min

Multycircuit Technology Limited

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