Materials: FR-4 Copper Thickness: 1 oz Layer Count: 6 layer, 1.6 mm Min. Hole Size: 10 mil Min.Line Width/Space: 6 mil Finishing: Immersion Gold + Hard Gold
Material: FR-4 Layer Coverage: 2L Thickness: 3.2MM Surface Technique: Immersion Gold Line Width/Space: 12mil/12mil Solder Mask Color: Green
High Tg FR4 Material 2.0 mm Thickness 6 Layers Immersion Gold Surface Treatment Green Solder Mask Carbon Ink
FR4 2. 0mm, red soldermask, Immersion gold+golden finger
Multilayer PCB with Immersion Gold surface treatment; black solder mask
Layer: 1L Material: Aluminum Board thickness: 1.6mm Surface technique: ImmersionGold Minimum hole size: 0.6mm Application field: LED, Automobile
8-layer PCB with impedance control. Surface Finish: Immersion Gold
Layer count: Single-sided PCB Board thiness: 0.8MM Copper thiness: 1oz Dielectric constant(DK): 3.48 Surface treatment: Immersion gold
General specification for Microwave/RF PCB Layer count: 1-6 Board thickness: 0.2-3.2mm Copper thickness: 0.5-4oz Dielectric Constant(DK): 2.2-10.3 Min trace width/spacing: 4/4mil Min drill hole size: 0.2mm Surface treatment: HAL(Lead free), I
EzPCB offers various kinds of surface finishing technology, including Sn/Pb, Ni/Au, immersion gold, chemical silver etc. Lead-free OSP finishing technology is our newly introduced service, and is welcomed by customers in the EU, US and in Austrilia.
