GTI-5000 BGA "Surface Mount" PCB Analysis The GTI-5000 Computer Image Processor is designed for the x-ray analysis of surface mount, BGA and PCB components. The software can provide analysis of BGA defects including bridging, voids and missing ball
Used in conjunction with Pressurex� pressure indicating films, Topaq� provides a quick, yet thorough analysis of the pressure distribution and magnitude between any two surfaces that come into contact. This Windows�-based system renders high resoluti
New Equipment | Assembly Services
Circuit card assemblies (CCAs) and box builds have been STI’s expertise for over 12 years. Our commitment to quality and customer satisfaction is what separates us from our competition. STI is proud to be ISO 9001:2008 certified which means that we c
The Linx is a breakthrough in cost effective x-ray inspection and an effective means of process evaluation. This compact system is suited to a broad range of applications including BGA, flip chip, PCB layer alignment and ge
Video micrometer software. Perfect companion to our video magnifier line allowing simple manual or complex automated measurement and sample analysis
Non-destructive infrared inspection system for circuit card assemblies. Uses high resolution infrared radiometers with WindowsNT software for image analysis.
SolarScan is a user-friendly software package for data acquisition and analysis.
New Equipment | Design Services
DFT（Design For Testability）Software Tebo TA V5.0 ( DFT Design for testability of software) Is unique within the electronics industry also has CAD Gerber Input connector professional / Fast Design for Testability analysis software. Can quickly and
New Equipment | Cable & Wire Harness Equipment
Overview The WinCrimp software enables quick and accurate collection of pull test and crimp force data and will significantly add to the traceability of your quality assurance data. The basic software version allows for uploading / downloading of c
New Equipment | Test Equipment
The TherMoiré® PS200S is a metrology solution that utilizes the shadow moiré measurement technique combined with automated phase-stepping to characterize out-of-plane displacement for samples up to 150 mm x 200 mm. With time-temperature profiling cap
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