Our fully automated silicon wafer dicing service consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems, we know that a good wafer dicing or wafer cutting process sets the pace for all rema
APD DEVELOPS creative solutions to challenging micro machining problems, using precision diamond dicing blades and lasers to cut and machine a variety of hard brittle materials.
New Equipment | Cleaning Agents
For Wafer Dicing / Laser sawing
We manufacture and distribute a complete line of resinoid,metal sintered, and nickel bond diamond dicing blades. Resinoid blades: used on Glass, Ceramic, Sapphire and Quartz. Nickel bond: used to cut Silicon and III-V materials. Metal Sintered stress
.jpg)
New Equipment | Assembly Services
OEM = Disco Model = DAD 320 Type = Dicing Saws Qty = 2 (sold as a pair) Recently came out of the fab, not stored in our warehouse in San Jose, California USA. Inspections are welcome with appointment. Inquire with questions or to make pickup or
1.jpg)
New Equipment | Assembly Services
OEM = Disco Model = DAD 320 Type = Dicing Saws Qty = 2 (sold as a pair) Recently came out of the fab, not stored in our warehouse in San Jose, California USA. Inspections are welcome with appointment. Inquire with questions or to make pickup or
We have a large on-hand inventory of Dicing Saws and parts. We would like for you to view our machines on our website: http://www.eartechnology.com
The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
NGA provides complete Micro automation dicing saw models 1006 and 1100 support. We rebuild Saws by doing a complete overhaul of the machine replacing neccessary parts to make the machine function like new. We have available spare parts for sale. W
.png)
