New SMT Equipment: dice (Page 2 of 2)

BioTech Services Division

BioTech Services Division

New Equipment |  

Our Bio-Tech Services division provides processes on a contract basis to companies engaged in the design and manufacture of various types of microfluidic devices. Our typical client is an R&D group looking for fast turn micro fabrication services fo

American Precision Dicing, Inc.

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

Majelac Technologies

New Equipment |  

Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela

Majelac Technologies

NEPTCO, Inc.

New Equipment |  

NEPTCO�s WAFERTAPE family of products for wafer mounting, dicing and backgrinding is designed to insure consistent, precise, and repeatable wafer production yields. NEPTCO's superior coating technology encompasses Total Thickness Variation (TTV) co

NEPTCO, Inc.

Quik-Pak, a division of GEL-PAK

Quik-Pak, a division of GEL-PAK

New Equipment |  

Quik-Pak, a division of GEL-PAK, offers state of the art clean room manufacturing and enhanced product capabilities which include MLF and MLP IC plastic packages. Quik-Pak offers unlimited open cavity plastic package configurations. Quick-Turn dicing

Quik-Pak

IC Packaging

IC Packaging

New Equipment |  

PROMEX INDUSTRIES now fills the need for on shore integrated circuit assembly and packaging foundry services for small lots and prototypes through medium volume production. We are committed to providing high quality, quick turnaround semiconductor

Promex Industries, Inc.

Porous Ceramic Chuck Table

Porous Ceramic Chuck Table

New Equipment | Components

Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, good porosity, durable absorption, excellent quali

Werlchem LLC

Precision tools

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

Precision tools

New Equipment |  

Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit

R&D Money

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