PROMEX INDUSTRIES now fills the need for on shore integrated circuit assembly and packaging foundry services for small lots and prototypes through medium volume production. We are committed to providing high quality, quick turnaround semiconductor
Porous ceramic vacuum chuck table or Polishing Chuck table supplied to semiconductor industry for silicon wafer dicing or finishing purposes. This product is an uniform compact frame, high strength, good porosity, durable absorption, excellent quali
The IDM is a single workstation sawing machine designed for speed and accuracy. It is equipped with a precision rotary tbale fitted with a precision gripper fixture, an auto conveyor width adjustment feature, plus an array of software tools to enhanc
Die Push-up Needles also named Ejector pins are mostly used in die bonding and die sorting process. The needle tip pushes up the die through the expanding adhesive film after dicing for pick up by a collet. Depending on the die size, single pi
Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry. Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer inspection
Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit
Ejector Pins are used to push the dice off the adhesive film during pick-up by the rubber pick-up tool. By employing precision machine technique and tight control, our ejector pins are manufactured with smooth and fine polished tips. Your productivit
To compliment our wafer dicing and inspection processes, Syagrus Systems offers fully automated die sorting services. Whether you require high volume production or a single wafer prototype build, Syagrus Systems has the die sorting solution for you.
10W UV Optowave Laser PCB Separator for Non-contact Depaneling Method PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and
Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. We have over 15 years of silicon wafer thinning and wafer backgrinding experi
