The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
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New Equipment | Assembly Services
OEM = Disco Model = DAD 320 Type = Dicing Saws Qty = 2 (sold as a pair) Recently came out of the fab, not stored in our warehouse in San Jose, California USA. Inspections are welcome with appointment. Inquire with questions or to make pickup or
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New Equipment | Assembly Services
OEM = Disco Model = DAD 320 Type = Dicing Saws Qty = 2 (sold as a pair) Recently came out of the fab, not stored in our warehouse in San Jose, California USA. Inspections are welcome with appointment. Inquire with questions or to make pickup or
We have a large on-hand inventory of Dicing Saws and parts. We would like for you to view our machines on our website: http://www.eartechnology.com
New Equipment | Cleaning Agents
For Wafer Dicing / Laser sawing
NGA provides complete Micro automation dicing saw models 1006 and 1100 support. We rebuild Saws by doing a complete overhaul of the machine replacing neccessary parts to make the machine function like new. We have available spare parts for sale. W
Our fully automated silicon wafer dicing service consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems, we know that a good wafer dicing or wafer cutting process sets the pace for all rema
10W UV Optowave Laser PCB Separator for Non-contact Depaneling Method PCB depaneling (singulation) laser machines and systems have been gaining popularity over recent years. Mechanical depanaling/singulation is done with routing, die cutting, and
Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry. Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer inspection
Our leading products are researched, developed and manufactured at Keteca USA, in Phoenix Arizona. Solution to bonding problem? Keteca Diamaflow is the Answer! The Sub-Micron Technology of today and the future requires continued improved methods to
