New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
Connectors is a device that connects two active devices to transmit currents or signals. Domestic connectors, known as the connector and socket, generally refers to electrical connectors. Essential performances of connectors and interconnects can be
BEST Inc. has been providing laser machined parts for the electronics industry for many years with both Kapton(TM) as well as as adhesive-backed Kapton (TM) shapes per customer requirements. These parts are being used as heat shields, spacers and mor
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New Equipment | Cable & Wire Harness Equipment
200 standard cables 2Yr Product Support Subscription (PSS): Comprising Warranty, free tech support, free software upgrades, and more. Renewable. Select Options: Hardware 128-point Expansion Module (attaches to base) 4-Wire Kelvin Resistanc
Consisting of multiple laminates and differing dielectric constants, this multilayer (displayed right) is a mixed-dielectric printed circuit board which was manufactured for the Aerospace Industry. Multilayer Mixed Dielectric PCB Specifications:
RO3000® high frequency circuit materials are ceramic-filled PTFE composites intended for use in commercial microwave and RF applications. This family of products was designed to offer exceptional electrical and mechanical stability. RO3000 serie
Gore offers a family of composite organic dielectric materials for chip package substrates and printed circuit boards. Manufactured in high volumes and supplied in standard sheet sizes, each product offers electrical properties, processing advantages
500⁰C) Compatible with multiple lamination cycles Standard PCB lamination cycles may be used Excellent for Laser Via formation Excellent CAF resistance Uses standard desmear and plating processes High Modulus: 1100 kpsi Lo
1). 6 oz (210μm) on BOT side. 2). 139.99*110.85mm=1 pcb 3). Base material: FR-4 4). 4 Layer, 1.6mm thick 5). Green solder mask/ white legend 6). Immersion gold. 7). Stack-up ---------- OVERLAY (TOP) ---------- SOLDER MASK (TOP)
Fab technology includes; 3 mil trace, 5 mil vias, micro SMT & BGA, controlled impedance, high speed dielectric laminates, blind & buried vias.
