When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
FKN Systek K5000 - Manual board feed PCB multiple panel singulation Singulate panels with up to 10 scorelines. Singulate panels with components up to 2.5" 3 models available: - Output tray - Straight output conveyor - Right angle output
Main product: SMT Assembly Reflow Oven, SMT Hot Air Reflow Oven, Lead Free Reflow Oven, SMT Reflow Oven, SMT Mounting Machine, Elctronic Equipment, PCB Machine, reflow oven, SMT Assembly, SMT/SMD Equipment, PCB Printer, screen printing SMT assembly
Full Hot Air Lead-Free Reflow Oven With PC Temp Control System (A800) Introduce: 1, Heating system adopts ETA patent heating technology 2, The use of imported large current solid state relay contact output, safe, reliable, equipped with a dedicated
1. The machine Special design for the IC sealing technical. 2. Heating temperature control device with Japan. Keep the temperature between dispensing end and basic board. Tolerance +/-1�� 3. Directly take the COB black glue into the tank, pick-a
The MicroSnugger� (PAT APP FOR) board handling system from SigmaPrint Technologies can be fitted to all MicroFlex and SMTech UP100 surface mount screen-printing machines. The system can be used to clamp boards from 0.8mm thick upwards. This system su
V groove pcb separator machine specification: Size:780 X 460X 560mm Machine Weight: 55Kg Minimize thickness: 0.6-3.5mm Minimize Speed: 100/200/300/500mm/s Features: 1. Separate pre-scored PCB assembly without stress on either PCB or componen
New Equipment | Test Equipment
A high percentage of boards that are tested using in-circuit testers (ICT), have boundary scan devices. These components may have individual JTAG port access or be connected in a chain, sharing common TCK and TMS signals. Since communication with the
New Equipment | Solder Paste Stencils
Through the increase of mixed technologies, stepped stencils have gained importance to the electronic assembly manufacturer. If the solder paste quantity can no longer be adequately regulated by adjusting Step/Relief Stencil Picture the pad sizes, st
