New SMT Equipment: different pastes (Page 1 of 8)

Precision Auger Pump

Precision Auger Pump

New Equipment | Dispensing

New Advanced Precision Auger Pump - Single Pump Solution The Precision Auger pump is designed to work with mid-to-high viscosity liquid such as glues, conductive, and non-conductive adhesive and pastes.  The pump is controlled with a servo motor equ

GPD Global

Large / Versatile Board Processing - DS Series Dispenser

Large / Versatile Board Processing - DS Series Dispenser

New Equipment | Dispensing

When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste

GPD Global

High Precision Dispenser - MAX Series (Non-Heated)

High Precision Dispenser - MAX Series (Non-Heated)

New Equipment | Dispensing

High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En

GPD Global

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

PCB Footprint Expert - Tens of Millions of Parts; 25 CAD Formats!

New Equipment | Software

The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo

PCB Libraries, Inc.

APR Solder Paste Dipping Plate

APR Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

Solder Paste Dipping Plate

Solder Paste Dipping Plate

New Equipment | Solder Paste Stencils

These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t

BEST Inc.

Component Printing Metal Stencil

Component Printing Metal Stencil

New Equipment | Solder Paste Stencils

Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin

BEST Inc.

3D-PatchWork® - Laser Cut 3D-Step Stencils

3D-PatchWork® - Laser Cut 3D-Step Stencils

New Equipment | Solder Paste Stencils

100µm we recommend a special squeegee blade which is adjusted to the cavity size. Benefits: Adjustable paste volumes in one printing process Simultaneous print process on all levels Different paste deposit heights on all levels Available with

LaserJob

PatchWork® - Laser Cut Step Stencils

PatchWork® - Laser Cut Step Stencils

New Equipment | Solder Paste Stencils

Step-up / Step-down Stencil. The patented step stencil from LaserJob, called PatchWork® - stencil, was developed to print in one printing step different paste deposit heights. Due to the multiplicity of different component leads on one printed circu

LaserJob

MK-2000

MK-2000

New Equipment |  

The MK-2000 consists of two independent print chambers - two print heads, two print tables, and two stencils - within a single device. This set-up provides ultimate flexibility for today's challenges in electronic manufacturing. Possible applications

MINAMI AMERICA INC.

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Gordon Brothers October 2-30, 2024 Auction

World's Best Reflow Oven Customizable for Unique Applications
SMT feeders

High Precision Fluid Dispensers
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