The PCB Footprint Expert is a powerful CAD library development tool powered by our own proprietary CAD LEAP Technology (Libraries Enhanced with Automated Preferences). It is packed with very powerful advanced library management features that cuts foo
Series 7900 Convertible DIP Lead Formers Automatically Adjusts for Body Thickness Variations. One Machine for .300", .400" and .600" DIPS Fast, Simple Conversion - Under 2 Minutes. Comes with Complete Conversion Kit Including Guides, Rollers and
New Equipment | Solder Materials
KappAloy15™ - 85%Sn - 15%Zn – has a wider plastic range of 390°F - 500°F (199°C - 260°C). This makes it ideal for hand soldering Aluminum plates and parts, allowing manipulation of the parts as the solder cools. KappAloy™ Tin-Zinc solder is designe
Description Bakelite sheet,also called phenolic paper laminated sheet.It is formed by heat pressing after the paper pulp dip into phenolic resin. It is the most common laminated sheet.It is also the most widely used industrial laminated sheet. Chact
Thickness:3-50mm,Size:1020x1220mm Description Bakelite sheet,also called phenolic paper laminated sheet.It is formed by heat pressing after the paper pulp dip into phenolic resin. It is the most common laminated sheet.It is also the most widely used
New Equipment | Solder Materials
KappAloy20™ - 80%Sn - 20%Zn For soldering of Aluminum to Aluminum and Aluminum to Copper. Good wetting. Used extensively in spray wire form for capacitors and other electronic parts. Higher temperature and higher tensile strength compared to 85Sn/15
New Equipment | Solder Materials
KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/
Single-Stroke Pneumatic Operation with Easily Interchangeable Dies Die changes in under 1 minute Steel base for extremely long life Large variety of dies available Slash labor costs over hand tool use Precision dies to protect components dur
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
New Equipment | Soldering - Other
Mini size wave soldering machine/DIP components soldering machine TB680 Mini size wave soldering machine/DIP components soldering machine TB680 ⅠSummary Desk wave soldering machine TB680 has been developed by Torch, It is the first equipment in
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