New Equipment | Rework & Repair Equipment
The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times. The simplicity o
New Equipment | Assembly Services
BEST can provide you with analysis services for your BGAs using x-ray equipment. We rework thousands of BGAs and POPs every year, therefore, we have the expertise in BGA X-ray inspection. BEST can be your outsourced BGA x-ray inspection source for o
New Equipment | Rework & Repair Services
BGA Reballing Services BEST provides BGA reballing services for your plastic-, ceramic- and metalbodied components down to 0.3mm pitch. We have the ability to develop the BGA reballing process you want with a variety of deballing methods and machine
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Solder Paste Stencils
Eliminate hours of solder mask damage repair time for bga sites while improving rework yield. Are you frustrated by the time it takes to repair mask damage underneath the BGA during the rework process? Are you squeezed for space on the PCB in an
New Equipment | Rework & Repair Services
http://www.flason-smt.com/product/China-BGA-Rework-Station-factory.html China BGA Rework Station factory Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60K
New Equipment | Rework & Repair Equipment
http://www.flason-smt.com/product/SMT-Assembly-line-Auto-BGA-Rework-Station-Optical-Alignment.html SMT Assembly line Auto BGA Rework Station Optical Alignment Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips
New Equipment | Rework & Repair Equipment
http://www.flason-smt.com/product/China-BGA-Rework-Station-factory.html China BGA Rework Station factory Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicable chips:Max 80×80mm Min 1×1 mm Weight:Approx.60K
New Equipment | Rework & Repair Equipment
http://www.flason-smt.com/product/SMT-Assembly-line-Auto-BGA-Rework-Station-Optical-Alignment.html Flason SMT Assembly line Auto BGA Rework Station Optical Alignment Demensions:L650×W630×H850mm PCB size:Max 400×390mm Applicabl
http://www.flason-smt.com/product/Samsung-SM310-Chip-Mounter.html Samsung SM310 Chip Mounter Samsung Pick and place machine Samsung chip mounter Samsung SM310 chip mounter Component range 0603 ~ 24mmCHIP Product description: Samsung SM310 Chi
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