1, All the main parts of the equipment are imported parts, long service life. 2, using the upper and lower two temperature control area, using PID automatic fuzzy temperature control system, high precision temperature control, high stability, tempera
New Equipment | Assembly Services
Unique advanced long-time heating system 1. Equipped with high efficiency and energy saving Swedish NI-CR heating tube, radiation power peak wavelength 4 UM, with surface reflector, high thermal efficiency, temperature rise speed, the forced air cir
IC'S, Hybrids SMT Silver glass curing BGA reflow Gold/tin reflow Package sealing with N2H2
explorFlow - SMT reflow system,Made by Vanstron Automation A high-quality reflow oven for medium/large production in the SMT industry. Fully prepared for the lead-free soldering process, this oven attains excellent thermal uniformity. Main Featu
New Equipment | Soldering Robots
Model R50CD (Computer) Heating zones Upper 5/lower 5 Length of heating zone 1730mm PCB width Chain 300mm, mesh 350mm Conveyor chain width range 50-300mm PCB direction L→R or （R→L） Chain fixing Front fix(back fix is optional) Conveyor hei
New Equipment | Rework & Repair Equipment
IR2015 Infrared reflow soldering section of BGA rework system Infrared temperature sensor monitors BGA surface temperature directly, realize close loop control, ensure precise temperature technical window and even heat distribution. PL2015 Precise
-Individual module heat zone design is convenience for maintenance -Adopts ��Star Shape Heater�� that is high solder performance for BGA, QFP components
New Equipment | Education/Training
All Bob Willis training workshops are run on site at your manufacturing facility, conference or exhibition venues Worldwide. We offer the largest range of theory and hands on workshops in the industry. The content of any workshop may be modified to s
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Provides support to PCB preventing substrate distortion * Prevents bottom side components from double-sided reflow * Eliminates operator intervention for screening, placement, and reflow * Transports odd-shaped PCB through conveyor * Accurately loc
This CD ROM is fully interactive and covers the different types of BGA component, design and process requirement with X-ray inspection of solder joints and a inspection standard for guidance. A Word document of the text is available on the CD ROM for
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