Volumetric Dispense Pump - PCD Technology revolutionizes how you dispense and how you perceive dispensing. PCD - Progressive Cavity Displacement PCD is a continuously volumetric dispense pump based on the Progressive Cavity principle. PCD technolog
Technical parameter： Model 1200 Printing area 1250×320mm Fixed printing position PCB Outer Or Pin Positioning Table trimming Front/Back±
Featured Items: Single 8mm tape Abrasive Block for Feeder Table Double side tape (8mm) SMT magazine rack Siemens Valve Plunger SP6 DST-8MM-00 (4)splice tape Stencil wiping rolls Splice Clip SMT tools,SMD tapes
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Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
New Equipment | Fabrication Services
Flexible PCB includes single sided FPC, double sided FPC and multilayer FPC, etc. Single FPC has chemically etched conductive pattern layer, the conductive pattern layer on the surface of the flexible insulating substrate is calendered copper foil. T
New Equipment | Board Handling - Storage
Double Faceplug Stackable PCB Transport Racks for up to 50 Printed Circuit Cards of up to 12.9" (330 mm) are made of antistatic material. Side plates can be adjusted from 3.2" (80mm) to 9.8" (250 mm). Available with PCB stop rods which can be mounted
JUKI RS-1R Pick and Place Machine Applicable Components: 0201~5050Board size:50×50-650×370mmFeeder inputs:max.112placement capacity:47,000 CPHProduct description: JUKI RS-1R Pick and Place Machine, Applicable Components: 0201~5050,Board size:50×50-6
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PTI-500 First Article Inspection Tester 版本号：PTI500V2.0 、 PRODUCT FUNCTIONALITIES ✦ADVANCED SOFTWARE, USER FRIENDLY INTERATIVE OPERATION MINIMALIST DESIGN ✦INTUITIVE VIEW OF TEST RESULT The test result is plotted on individual component which can be
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
New Equipment | Rework & Repair Services
BGA Reballing and Solder Bumping for all types of SMD's Lead, Lead Free and Solder Alloy Conversion. Package types include but are not limited to: PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array) uBGA (Micro BGA) CCGA (Ceramic Colum
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