New SMT Equipment: dpak stencil designs (Page 10 of 13)

SemiTouch STW-1 Wafer Printing / Bumping System

SemiTouch STW-1 Wafer Printing / Bumping System

New Equipment |  

» Combined system technology (wafer printer and wafer bumper) » Unsurpassed vibration squeegee printing technology » Robust design to ensure years of dependable operation The SemiTouch Wafer Printer / Bumper is an easy to use, highly robust semi-auto

Milara Inc

Non-Conductive Pastes (NCP)

Non-Conductive Pastes (NCP)

New Equipment | Materials

For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati

Zymet, Inc

Prototype PCBA Turnkey Solution $1,199.00

Prototype PCBA Turnkey Solution $1,199.00

New Equipment | Assembly Services

Description NexPCB Prototype Printed Circuit Board Assembly (PCBA) Turnkey Solution is a package to help you through design verification stage. You just need to send the required files, listed below and let us handle all the complex production mana

www.nexpcb.com

PrinTEK Ultra-Fine Pitch Benchtop SMT Stencil Printer

PrinTEK Ultra-Fine Pitch Benchtop SMT Stencil Printer

New Equipment | Printing

A highly refined and capable Ultra-Fine Pitch printer suited for all types of Fine Pitch SMT production. PrinTEK I MP-1818 embodies Transition Automation’s 20+ years of expertise in Fine Pitch SMT printing and squeegee design to give users an unpara

Transition Automation, Inc.

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials

NeoHorizon iX - Screen Printer

NeoHorizon iX - Screen Printer

New Equipment | Printing

With its modular design, the latest generation of our powerful screen printers is customizable for any customer-specific or application-specific requirements. Clamping systems, conveyors, toolings, paste management, verification, the new version of t

ASM Assembly Systems (DEK)

NC676 - No Clean Solder Paste

NC676 - No Clean Solder Paste

New Equipment | Solder Materials

NC676 No Clean Solder Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time

FCT ASSEMBLY, INC.

WS159 - Water Soluble Solder Paste

WS159 - Water Soluble Solder Paste

New Equipment | Solder Materials

WS159 water washable solder paste is designed to provide humidity tolerance and excellent wetting to meet the requirements for reliable solder joints in PCB Assemblies. WS159 offers high levels of repeatability and consistency even in a wide range of

FCT ASSEMBLY, INC.

TREK Industries, Inc.

TREK Industries, Inc.

New Equipment |  

TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci

Trek Industries

TREK Industries, Inc.

New Equipment |  

TREK INDUSTRIES is a recognized leader in cleaning equipment for the most demanding applications. This experience in controlled process and precision cleaning has become valuable in working with many critical cleaning applications such as printed ci

Trek Industries


dpak stencil designs searches for Companies, Equipment, Machines, Suppliers & Information

Void Free Reflow Soldering

High Resolution Fast Speed Industrial Cameras.
Sell Used SMT & Test Equipment

Component Placement 101 Training Course
High Throughput Reflow Oven

Software for SMT placement & AOI - Free Download.
SMT feeders

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