• High efficiency: Consistent operation for automatic cleaning, grinding, examining and put up/down materials. Make sure the grinding efficiency of Drilling. • Low cost: Accurate control of grinding quantity, increase grinding time and reduce cost. •
A high speed micro via drilling system, the GS-600 incorporates a dual laser system for the highest throughput and hole quality. Capable of producing up to 900 holes/second, the hole diameters can range from 0.001" to 0.010". The GS-600 is compatib
Shanghai Well-Sun Precision Tool Co., Ltd Choose the super-fine grain solid carbides from the famous corporation of the world as our main raw materials.The products are adopted the computer-aided design(CAD & CAM),processed by high precision CNC mach
ProbeMaster is your complete solution to bare board electrical testing, allowing you to control the entire electrical testing process from beginning to end. ProbeMaster includes: Gerber data eding and CAM Netlist extraction, conversion and
Up to 20 layers, 4 mil traces / spaces, 6 mil drilled holes and Book-bind capability. MIL-P-50884 approved for adhesiveless materials. Deliveries down to 3 days are available.
Capabilities include: Up to 30 layers, 3 mil traces and spaces, 6 mil drilled holes, available in 24 hours to 2 weeks.
Capabilities include: 1 to 20 layers, adhesive based or adhesiveless, 3 mil traces and spaces, 6 mil drilled holes, available in 3 days to 20 days
Capabilities include: 2 to 20 layers, 3 mil traces and spaces, 6 mil bond pitch, 6 mil drilled holes, internal cavity and consistent wire bondable gold.
With a 10.4'' transflective display, hot-swap batteries and IP65 sealing, the HH3 is top of the line for outdoor use, from sales force to drilling rigs.
The Laser Microjet� grinding system is suitable for grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge. For more information please visit our website
