M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
New Equipment | Board Handling - Pallets,Carriers,Fixtures
Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G
Painless Profiling for Perfect Oven Recipes When utilizing the AutoM.O.L.E.®Xpert3 System, you are entering a new phase in the thermal management of your automated soldering operations. The new AutoM.O.L.E.®Xpert3 System automatically guides you thr
Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr
Classic PCB Profiling tools are used to create a repeatable thermal process that meets the specifications required by the solder paste and or component manufacturers. Only by profiling do you have any idea of what the actual temperatures are on the c
The only portable reflow oven optimizers with statistical process control (SPC). Regardless of the recipe and what your reflow oven's controls indicate, what your PCB actually experiences at board-level as it goes through the oven can be SIGNIFICANT
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