New SMT Equipment: ecd mole heller (Page 1 of 3)

1809 MK5 - Heller 고급 인라인 무보이드 / 진공 리플로우 솔더링 오븐

1809 MK5 - Heller 고급 인라인 무보이드 / 진공 리플로우 솔더링 오븐

New Equipment | Reflow

9개 존을 갖춘 무보이드 진공 리플로우 솔더링 오븐. 균형적 흐름 기술이 있는 무보이드 / 진공 리플로우 솔더링 질소 시스템 9개의 탑 및 바텀 가열 존 - 업계 최고의 직선형 피트당 최고의 존 수! 100인치 가열 길이 - 고처리율 제공! 2개의 내부 냉각 존 - 최저 출구 온도 제공! 총 길이 180인치 - 바닥면적 활용 최적화! 10인치 모듈의 새로운 모듈 디자인이 프로파일을 보다 작은 세그먼트로 세분화할 수 있는 유연성을

Heller Korea Ltd.

대량 생산을 위한 컨벡션 리플로우 오븐.  - 1826 Mark 5

대량 생산을 위한 컨벡션 리플로우 오븐. - 1826 Mark 5

New Equipment | Reflow

세계 최고의 컨벡션 리플로우 오븐 대량의 요구에도 일관된 성능을 제공하는 동시에, 예방적 유지관리와 바닥면적은 최소화합니다 무납 인증! 유지관리 불필요! 최저의 질소 & 전기 사용! 무료로 제공되는 통합 Cpk 소프트웨어! 최근 Mark 5 리플로우 시스템 관련 혁신이 이뤄져, 보다 더 낮은 소유비용으로 제공됩니다. Heller의 새로운 가열 및 냉각 접근 방식은 최대 40%까지의 질소 및 전기 소비 절감을 제공합니다.

Heller Korea Ltd.

M.O.L.E.® MAP Thermal Profiler Software

M.O.L.E.® MAP Thermal Profiler Software

New Equipment | Software

M.O.L.E.® MAP is ECD's current software for setup, download, analysis, prediction and data storage that ships with the all new SuperM.O.L.E.® Gold 2 thermal profiler, the MEGAM.O.L.E.® 20, the V-M.O.L.E.®, the PTP® VP-8 and the SuperM.O.L.E.® Gold, E

Electronic Controls Design Inc. (ECD)

M.O.L.E.® Reflow Oven Thermal Profilers

M.O.L.E.® Reflow Oven Thermal Profilers

New Equipment | Reflow

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

OvenCHECKER™ Reflow Oven Verification Tool

OvenCHECKER™ Reflow Oven Verification Tool

New Equipment | Reflow

Built around ECD's award winning V-M.O.L.E.® Thermal Profiler, the OvenCHECKER™ system comes complete with the profiler, thermal barrier, pallet and M.O.L.E.® MAP software, making it a complete solution for reflow oven verification. OvenCHECKER™ gr

Electronic Controls Design Inc. (ECD)

SuperM.O.L.E.® Gold 2  Flux and Wave Solder Thermal Profilers

SuperM.O.L.E.® Gold 2 Flux and Wave Solder Thermal Profilers

New Equipment | Board Handling - Pallets,Carriers,Fixtures

Time and temperature are very important variables in soldering printed circuit boards. It is important to bring the circuit board assemblies up to a high enough temperature for a long enough period to effectively solder the components to the board. G

Electronic Controls Design Inc. (ECD)

Heller 2043 MK5 Lead Free Reflow Oven

Heller 2043 MK5 Lead Free Reflow Oven

New Equipment | Reflow

Like new condition Heller 2043 MK Lead Free Reflow Oven.  See several images and facilities drawings in the link. 2043MK5: Ultra Low Power Consumption Convection dryer Oven original price at $122,776.00 1.100% Forced Convection Reflow Oven with the

Xsys Engineering inc

MEGAM.O.L.E.® 20 Channel Thermal Profiler

MEGAM.O.L.E.® 20 Channel Thermal Profiler

New Equipment | Reflow

Do you demand the highest density of thermocouples placement possible on your Hi-Reliability, High-Value PCB? ECD's got your Spec! Do you expect a software package that flexes with your workflow, providing customizable data extractions, Imports of yo

Electronic Controls Design Inc. (ECD)

Heller 1809 Mark III Vacuum Reflow Oven

Heller 1809 Mark III Vacuum Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III Vacuum Reflow Oven Reflow Oven SMT Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Product description: Heller 1809 Mark III Vacuum Reflow Oven  INQUIRY Heller 1809 Mark III Vacu

Flason Electronic Co.,limited

Heller 1809 Mark III Vacuum Reflow Oven

Heller 1809 Mark III Vacuum Reflow Oven

New Equipment | Reflow

Heller 1809 Mark III Vacuum Reflow Oven SMT Reflow Oven Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Product description: Heller 1809 Mark III Vacuum Reflow Oven Heller 1809 Mark III Vacuum Reflow Oven Specifications: NITROGEN

Flasonsmt Co.,ltd


ecd mole heller searches for Companies, Equipment, Machines, Suppliers & Information