Retrofit existing system with Innovative Dispensing Technology for Excellent Dispense Control and Repeatability Advanced pump technologies available for retrofitting include: True Volumetric Pump, Precision Auger Pump, Simplified Jetting Pump and Ti
High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
FKN Systek K3000 - Singulate scored and skip scored panels up to 24" long ESD protective mat on back table Adjustable front and back support table Singulate panels with components up to 2.5" high Available in 18" blade (standard) or 24" blade (
New Equipment | Rework & Repair Services
Your BEST Source For High Quality Industry-Leading BGA Repair Service BEST provides industry-leading solutions for Ball Grid Array BGA Repair Services and other grid array device reworks. Our engineers have developed better processes to make our BGA
New Equipment | Rework & Repair Equipment
The BEST PCB Epoxy Repair Kit can be used to repair lifted pads and traces as well as build up and repair edge corner damage to PCBs or repair solder mask which has been damaged or removed. By adding colorants a pcb color epoxy kit can be made up cus
New Equipment | Rework & Repair Services
BGA Rework Service - Your BEST Source For High Quality BGA Rework Services BEST provides industry-leading solutions for BGA and other grid array device reworks. Our engineers have developed better processes to make BGA Rework Service more repeatable
New Equipment | Fabrication Services
Gold Finger PCB No of layer: 6 layer Material: FR-4, TG170 Thickness: 1.6mm Copper thickness: 35um copper/1oz Yellow Solder Mask Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um Special technology: gold finger/Edge connector plating, go
New Equipment | Coating Equipment
Mask is for protecting some components in lacquering. All other areas of the PCB and components require conformal coating to be applied which is the vast majority of the area. The pin header connectors require masking over their full height to avoid
SUSS MicroTec's newest product offering is a 300 mm lithography cluster which consists of an MA300 mask aligner module linked to an ACS300 spin-coating system. LithoPack300 (LP300) is specifically designed for wafer bumping and wafer level packaging
Semi-automatic high precision reflow soldering system assures high volume repeatability and the fastest throughput and flexibility for production. Ideal for applications such as flex to PCB, edge connectors to PCB, ribbon cables to PCB, PCMCIA conne
