New Equipment | Fabrication Services
Base Material: FR4 Layer count: 4 layer Board thickness: 1.6mm Copper Thickness:1 oz Surface finish: nickel gold plating Soldermask Colors: Green Size:159.25*182/1up
Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa
PCB Prototype - 2 Layer, Hard Gold Plating 30u", Controlled Deep Cut/Milling And Special CNC - 2 layer, hard gold plating 30u", controlled deep cut/milling and special CNC. - Red solder mask.
REPAIR & REWORK OF GOLD CONTACTS, E.G. GOLD FINGER,CONNECTORS, SOLDER ON GOLD PROBLEM, COSTUME JEWELLERY, DENTAL, OPTICAL, ETC.
Rogers Material 1.6mm Thickness 2 Layers 1oz copper thickness Gold Plating Surface Treatment red Solder Mask e-test
New Equipment | Assembly Services
PCB Prototype - 2 Layer, Metal Core Board, Hard Gold Plating 30u", With Black Solder Mask - 2 layer, metal core board, hard gold plating 30u", with black solder mask. Advantages: - Metal core board. A PC board to be populated with electronic compo
Autoprocess Far East Company Ltd have been designing and manufacturing cost effective PCB manufacturing equipments for over 24 years. We carry a wild range of products, namely * Automatic Plating Equipment for pre-process and Plating from 10 sqft/
Autoprocess Far East Company Ltd have been designing and manufacturing cost effective PCB manufacturing equipments for over 24 years. We carry a wild range of products, namely * Automatic Plating Equipment for pre-process and Plating from 10 sqft/
Gold finger PCB/Impedance computer circuit board Layer:6 Thiness: 2.0mm Surface treatment: ENIG+Hard gold plated on gold finger Impdance control: Single-ended 50ohm, differential 90 ohm Application: Computer
Layer: 8 layers Material: FR-4 Board Thickness: 0.6mm Surface Finish: Immersion Gold 1~4u Copper Thickness: 1/3 oz Impedance, 4/4mils width/spacing Layers: 2--36layers Max manufacturing size: 640mm*1100mm Copper foil thickness: 0.5OZ-13OZ M
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