New SMT Equipment: eliminate lga (Page 1 of 1)

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste

New Equipment | Solder Materials

90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r

AIM Solder

Bob Willis Online Training

Bob Willis Online Training

New Equipment | Education/Training

Our web based seminars represent an efficient way for you and your team to develop practical knowledge, delivering expert advice and guidance to you where, when and how you choose. Simple webinars offer a low cost and time efficient training option.

ASKbobwillis.com

Eureka TUS-1001 Fast Super Dryer Dry Cabinet

Eureka TUS-1001 Fast Super Dryer Dry Cabinet

New Equipment | Board Handling - Storage

Eureka TUS-1001 Fast Super Dryer Dry Cabinet Specs: http://eurekadrytech.com/fast-super-dryer/tus-1001 Model: TUS-1001 Fast Super Dryer Capacity: 657 Liters Humidity Range: 10%-50% Recovery Time: Recovers to ≤ 20% RH within 2 hours after accessing

SMT Dry Cabinets by Eureka Dry Tech

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