Fujiwa Transfer Encapsulation Press model: tep250-40SD manuf: 11-1995 tonnage: 250-4 stroke: 300 light:750
New Equipment | Rework & Repair Equipment
MLT provides laser decapsulation, "decap", services for removing encapsulation or mold compounds for accessing wirebonds, die, leadframes, and substrates.
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT256EP solderable adhesive is self-leveling and self-soldering adhesives, which has been designed for high temperature Pb-free application. By comparison with conductive adhesives (Ag), SMT256EP solderable adhesive has higher stable electrical and
For Die attach / Die bonding / Potting / Casting / Encapsulating / etc.
New Equipment | Assembly Services
Rapid Coatings offers both manual and automated coponent underfill services using a variety of encapsulants to help protect customer's sensitive compnents on their assemblies.
New Equipment | Assembly Services
Rapid Coatings offers both manual and automated coponent underfill services using a variety of encapsulants to help protect customer's sensitive compnents on their assemblies.
We offer electronics potting and encapsulation services to help protect your electronics against shock and vibration, corrosion, and contaminants such as dust, moisture and chemicals.
We offer electronics potting and encapsulation services to help protect your electronics against shock and vibration, corrosion, and contaminants such as dust, moisture and chemicals.
Henkel's Technomelt products are engineering hotmelt adhesives for industrial applications in various market segments. Henkel's renowned TECHNOMELT low pressure molding solution is delivering superior sealing adhesion and excellent temperature and
