New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
New Equipment | Fabrication Services
Gold Finger PCB No of layer: 6 layer Material: FR-4, TG170 Thickness: 1.6mm Copper thickness: 35um copper/1oz Yellow Solder Mask Surface finishing: ENIG, gold 0.05-0.1um, Nickel 3-5um Special technology: gold finger/Edge connector plating, go
FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test
4Layer PCB TG≥135 degree PCB thickness: 1.6mm Copper thickness:4OZ Green solder mask White silkscreen Surface treatment: ENIG Min Line/space: 20/20mil Min hole: 28mil Brand Name:SYSPCB
New Equipment | Surface Finish
Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed
New Equipment | Fabrication Services
Flex part 2Layer PCB Polymid PCB thickness: 0.15mm Yellow coverlayer White Silkscreen Surface treatment: ENIG Min Line/space: 6/6mil Min hole: 4mil Rigid part 6Layer PCB PCB thickness: 0.8mm Green solder mask White Silkscreen Surface treatment: ENIG
FR-4 Material 2. 4 mm Thickness 3OZ base Cu 10 Layers Immersion Gold Surface Treatment Green Solder Mask
Radial Resin Bead NTC Thermistor Temperature Sensor is polycrystalline mixed oxide ceramics made semiconductor type NTC Thermistor chip soldered with radial metal wire, coated with epoxy resin bead, for temperature measurement range -45C to +125C.
New Equipment | Assembly Services
PNC Inc. has been manufacturing hi-reliability printed circuit boards since 1968. All Military Spec PC boards are manufactured in the security of our Nutley NJ, USA facility. PNC is certified by the Department of Defense to Military Performance Speci
New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
