New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
splice tape, which allow to join the carrier tape without shutting off the machine. clean wiper, high entrapment and low lint and high absobency. label, anti-eletronic and weather-proof and good resistant to solvent and high temperature.
splice tape, which allow to join the carrier tape without shutting off the machine. clean wiper, high entrapment and low lint and high absobency. label, anti-eletronic and weather-proof and good resistant to solvent and high temperature.
using our splice tape for SMT, which guarantee perfect and reliable joints in punched carrier tapes without shutting off the machine 1)high efficiency 2)reducing SMT machine and feeder abrasion: 3)energy saving 4)make full use of component in the car
using our splice tape for SMT, which guarantee perfect and reliable joints in punched carrier tapes without shutting off the machine 1)high efficiency 2)reducing SMT machine and feeder abrasion: 3)energy saving 4)make full use of component in the car
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
New Equipment | ESD Control Supplies
Polyester wiper is constructed from continuous filament microdenier polyester.These strong filaments have a high yarn-to dust contact surface area,ensuring excellent wiping efficiency.Furthermore,its wedge-shaped cross-section acts as squeegies for s
Dual Lane Screen Printing. The SPD (screen printer dual) features high-speed simultaneous production of two boards of the same type or two completely different products. Non-stop model changeover capability allows changeover of one stencil while th
Henkel’s line of Loctite Hysol® and Loctite Eccobond™ encapsulants are primarily used to ensure environmental protection and boost the mechanical strength of wire bonded devices. They are developed to provide protection to wire bonds, leads and alumi
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