New SMT Equipment: epoxy dot swelling (Page 1 of 2)

DV-7000 Heli-Flow Pump

DV-7000 Heli-Flow Pump

New Equipment | Dispensing

The DV-7000 Heli-Flow® pump is a third-generation encoded auger pump. The pump has a floating head for use with footed needles to make fast, repeatable dots of solder paste and silver epoxy. The dispense gap is mechanically controlled by the needle,

ASYMTEK Products | Nordson Electronics Solutions

Surface Mount Epoxy 4089

Surface Mount Epoxy 4089

New Equipment | Dispensing

Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure, 

AIM Solder

DOT LINER 6.6 - Automated Dispenser

DOT LINER 6.6 - Automated Dispenser

New Equipment | Dispensing

Dispensing Equipment for Small Batches and Rework Micro dispensing for small batches and rework. Precisely dispense solder paste, epoxy and underfill with the highest consistency, even for the smallest dots. For 25 years MARTIN have been setting

MARTIN (a Finetech company)

SM-150G/SM-155P Epoxy Adhesives

SM-150G/SM-155P Epoxy Adhesives

New Equipment | Solder Materials

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process

Shenmao Technology Inc.

EP-837 Two-part Epoxy Staking Adhesive

EP-837 Two-part Epoxy Staking Adhesive

New Equipment | Materials

6 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi

Conductive Compounds, Inc.

EP-600 Two-part Silver Conductive Epoxy

EP-600 Two-part Silver Conductive Epoxy

New Equipment | Materials

4 hours Thin Film Set Time (.001" @ 25°C) >12 hours Total % NV Solids 100% Hegman Gauge Volume Resi

Conductive Compounds, Inc.

SM-150G / SM-155P Single Component Epoxy Adhesive

SM-150G / SM-155P Single Component Epoxy Adhesive

New Equipment | Solder Materials

SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process

Shenmao Technology Inc.

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

New Equipment | Materials

EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle

Conductive Compounds, Inc.

T&H 3 axis high precision dispensing(coating) robots

T&H 3 axis high precision dispensing(coating) robots

New Equipment |  

1. The machine is designed for fast dispensing placement accuracy and repeatability without the expense for fast dispensing placement accuracy and repeatability ,even without the expense of coordinated X.Y moving ,it seamlessly integrates windows

cixi tianhao dispensing equipment co.,ltd

Track, Trace and Control Solutions

Track, Trace and Control Solutions

New Equipment | Inspection

Complete TTC Solutions for Electronics Applications Industry leaders within electronics and semiconductor manufacturing need to enable lean manufacturing, assure quality, and optimize efficient use of resources. Microscan products help these compan

Microscan

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