ASYMTEK Quantum Q-6800 High-Value Fluid Dispensing System. ASYMTEK Quantum Q-6800 Series. A high-value fluid dispensing solution for demanding applications. Large dispense area (423 x 458 mm) for varied substrate sizes Supports CSP, BGA, and boa
New Equipment | Test Equipment
Hanwha SM471 Plus SMT Assembly Line Hanwha SM471 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:78000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
New Equipment | Test Equipment
Hanwha SM481 Plus SMT Assembly Line Hanwha SM481 Plus SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed:40000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young SPI, Automatic Pick and place mach
New Equipment | Assembly Services
Hanwha HM520 SMT Assembly Line Hanwha HM520 SMT Assembly Line, Usage: PCB production, Full Automatic Assembly line, Speed: 80000CPH, it's with Automatic PCB Loader, Automatic SMT stencil Printer, Koh Young KY 8080 3D SPI, Automatic Pick and place ma
Epoxy 4089 is a single part, epoxy adhesive used for bonding SMT components to a PWB prior to double sided reflow or wave solder assembly. Epoxy 4089 has been formulated for use in all types of high speed dispensing equipment including air pressure,
Underfill FF35 is a low surface tension, one component epoxy resin designed for use as a capillary flow underfill for flip chip, CSP, BGA and uBGA assemblies. Underfill FF35 offers excellent capillary action for flat, fast and complete spread. Underf
New Equipment | Solder Materials
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process
New Equipment | Assembly Services
Surface mount assembly (SMT) Thru hole device (THD) Surface mount plus Thru hole (SMT+THD) Lead and Lead free construction Cable construction Conformal Coating Potting Epoxy / Resin encapsulation 3D Encapsulation Testing
New Equipment | Solder Materials
SM-150G and SM-155P are single component epoxy adhesive, specifically designed for the bonding of surface mount devices to PCB in the lead-free process. SM-150G is suitable for glue dot process and SM-155P is suitable for the printing machine process
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
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