New Equipment | Education/Training
This is a combination lectured and hands-on course covering the information in the IPC J-STD-001 document. The J-STD-001, “Requirements for Soldered Electrical & Electronic Assemblies”, describes materials, method and acceptance
New Equipment | Wave Soldering
For selective thru-hole components soldering on PCBs made in mixed technology http://www.selen.hr/pokaz_kategorie.php?cid=62
Description Ricocel is made by fiber glass cloth and high temperature resin. It is an ideal material for solder pallets, wave solder pallets, SMT solder pallets, SMT solder fixtures, selective solder fixtures and other specialty soldering fixtures.
LIGHTSPEEDMFG provides quick-turn BGA services including rework and reballing. It's our specialty! We're your best choice for rework, reballing, inspection, ECOs and upgrades, for BGA, CGA, �BGA, and other component types. Our advanced BGA rework
New Equipment | Rework & Repair Equipment
Allgood Technology is equipped with a range of tools to rework and repair printed circuit assemblies to IPC-A-610 or your own company standards. Major Plant List: Metcal MFR-1351 Desoldering Station for through hole desoldering. Le
New Equipment | Board Handling - Pallets,Carriers,Fixtures
WAVE SOLDER PALLETS, PROCESS CARRIERS, REFLOW FIXTURES, SELECTIVE SOLDER FIXTURES, SURFACE MOUNT CARRIERS, CONFORMAL COATING FIXTURES, ADJUSTABLE FIXTURES, CUSTOM TOOLING AND FIXTURES, MACHINING SERVICES WWW.EMCGTI.COM Check out our FACEBOOK Pa
New Equipment | Tape and Reel Equipment
ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment. The preform is placed directly into the solder paste prior to assembly reflow. Alpha So
The long-term inspection solution for wave, reflow, pre-reflow and selective soldering. In the manufacturing of electronic assemblies, optimization of the production processes is a major factor in the success of producing to the high demands of qual
New Equipment | Test Equipment
“Dip & Look Test”— The Pulsar provides precise handling of electronic components for the automated process of a flux and solder dip of the component terminations. After the dip process, the operator inspects the terminatio
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
winsouce.jpg)
