3°C/sec. Excellent ROI (Return of Investment). Wide process window for “universal profiling”. 50% less Nitrogen consumption than other systems.
ePlace is a newly designed software based on the Essemtec software architecture “eez-Technology”. Fingertip operation Easy to use Universal CAD input Zoom of camera windows ePlace Simplifies Complexity ePlace defines a new standard of a user
Versatile reflow oven for medium volume soldering (leadfree or leaded solder). 400 mm process width. Integrated microprocessor for profile control and storage. Extra high air volume for perfect soldering of complex boards. 5 zone reflow oven 400
Small but powerful reflow oven. 300 mm process width. Sophisticated zone separation between zones enables profiles that are normally possible only on larger and much more expensive systems. Small footprint 2.0x0.7 m. 4 zone convection 300 mm sold
The new eMIS Management Software Suite for SMD production includes functions for job planning, feeder setup optimization, stock management, traceability, operational data analysis, line management and much more. With eMIS, managers and operators can
New Equipment | Board Handling - Storage
Flexible, Fully Automatic SMD Storage System. Cubus - the next-generation SMT storage device – innovates how SMT components are stored and provisioned for electronic manufacturing. For the first time, a storage device is fully user configurable and
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