Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
High-Mix, Medium Volume Automated Optical Inspection The Supra E is the class-leading, cost effective solution for all PCB manufacturers with PCBs up to 20” x 20”. MVP’s Quad-Color technology provides the ability to use multiple angles of light t
The Ultra V is MVP’s fastest AOI system, designed for manufacturers with the need for the fastest beat rates. The Ultra V Series deploys the highest speed interfaces, computers and camera technologies to provide the fastest inspection times without
The largest format AOI solution for large board sizes or backplane inspection. The Spectra Series Tri-Color Technology system is MVP’s large format AOI solution. The Spectra has a standard handling size of 24 x 24 inches (610 x 610mm). The optional
Microelectronics and Semiconductor Inspection. MVP's 850G provides the highest accuracy flip-chip, die assembly inspection. Ensuring the correct placement of the die on the substrate, while providing edge, FM and surface inspection. The 850G modu
NPI and Low Volume Desktop Automated Optical Inspection with In-line Performance. MVP's GEM Compact AOI system is a revolutionary tabletop, lightweight inspection solution. MVP is now offering unsurpassed high performance and high resolution capabi
The MVP Selecta is a new product designed to complement your selective solder system and allows you to inspect the components soldered by your bottom-side soldering solution. MVP’s Selecta allows for full bottom-side inspection of all wave and reflow
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