New SMT Equipment: eutectic solder (Page 1 of 3)

BGA Rework & X-Ray

New Equipment |  

BGA component types, characteristics, eutectic and non-eutectic solder, ceramics, determination of profiles, equipment, BGA removal, site preparation, reballing, soldering , cleaning etc.

C-G Technology Marketing

Kapp Electric Eutectic - Tin Lead Silver Solder for Electronics ( solid or Rosin cored )

Kapp Electric Eutectic - Tin Lead Silver Solder for Electronics ( solid or Rosin cored )

New Equipment | Solder Materials

With a composition of 62% Tin / 36% Lead / 2% Silver, Kapp Electric Eutectic is a cost effective eutectic electrical/electronic solder where Lead is permissible. Silver increases the strength and vibration resistance of the joint in higher stress app

Kapp Alloy & Wire, Inc

BGA Socketing Systems

New Equipment |  

Three solutions for virtually any application. BGA Socket Adapter Systems featuring eutectic solder balls and footprints which match BGA device are designed for high volume production applications. Pop-Top� Socket Adapter Systems features integral he

Advanced Interconnections Corporation

KappAloy9™ - Solder for Aluminum to Aluminum, Copper and Brass

KappAloy9™ - Solder for Aluminum to Aluminum, Copper and Brass

New Equipment | Solder Materials

KappAloy9™ 91% Tin / 9% Zinc solder is the eutectic standard solder for Aluminum to Aluminum and/or Copper. It is used extensively in oven soldering and other automated soldering systems. Learn more and order: http://www.solderdirect.com/all-produc

Solder Direct

Kapp 509 - Cadmium Zinc Multipurpose Solder

Kapp 509 - Cadmium Zinc Multipurpose Solder

New Equipment | Solder Materials

Cadmium-Zinc solders are medium temperature alloys that provide strong, corrosion- resistant joints on most metals. The eutectic solder is the industry standard, Kapp 509. It melts and solidifies at 509°F and 265°C, making it an ideal solder for oven

Kapp Alloy & Wire, Inc

DESOLDERING TOOLS: SC-400A

DESOLDERING TOOLS: SC-400A

New Equipment | Other

Double Pump for a quick and powerful suction and easy clean up. Designed For SMT and Thru-hole Desoldering of Eutectic or Lead Free Solders.

DEN-ON INSTRUMENTS CO., LTD.

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

KappZapp3.5 - Tin Silver Solder for Stainless Steel to Stainless Steel and Copper

New Equipment | Solder Materials

Low melting temperatures prevent loss of properties and minimize distortion on thin wires and sheets. KappZapp3.5™ Tin-Silver alloys are used for electronics, fabrication, ducting, food containers, storage bins, instruments, Copper plumbing pipe, and

Kapp Alloy & Wire, Inc

SIPAD Solid Solder Deposit (SSD)

SIPAD Solid Solder Deposit (SSD)

New Equipment | Other

SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a

SIPAD Systems Inc.

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

KappAloy9 - Tin Zinc Solder for Aluminum to Aluminum and Aluminum to Copper

New Equipment | Solder Materials

KappAloy9™ - 91%Sn - 9%Zn - 390°F (199°C) eutectic alloy is the best solder for soldering Aluminum wire to Copper busses or soldering Copper wire to Aluminum busses or contacts. Its low eutectic melting point minimizes heating of critical electrical/

Kapp Alloy & Wire, Inc

BGA / SMT Rework & Repair

BGA / SMT Rework & Repair

New Equipment | Rework & Repair Services

Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb

Process Sciences, Inc.

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