AIM is a leading global manufacturer of solder assembly materials for the electronics industry. Our product line includes solder paste, liquid flux, bar, wire, preforms, adhesives, cleaners, chemicals, plating anodes and indium and gold alloys. We al
New Equipment | Selective Soldering
The ECOSELECT soldering system is the optimal solution for small to medium volume production needs. With the option to operate the system inline or off-line, the ECOSELECT excels in versatility. Over the last 15 years, Ersa has placed more than 100
New Equipment | Cleaning Agents
MICRONOX® MX2302 is an engineered semiaqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux from wafer bumps found in flip chip, chip scale and μBGA packages. MICRONOX® MX2302
New Equipment | Solder Materials
AMTECH’s Tacky Paste Fluxes (TF) are designed to meet and exceed industry standards. TFs are used for general touch-up and rework of PCBs, and for the attachment of spheres to BGA and mBGA packages. Operations such as soldering Flip Chip components t
Cookson Electronics Assembly Materials is the world leader in the development, manufacturing and sales of innovative materials used in the electronic assembly process. Cookson Electronics Assembly Materials is a full line supplier of Solder Paste, St
New Equipment | Cleaning Agents
Broad Spectrum Electronics Cleaning Solvent IONOX® I3302 is a semi-aqueous solvent blend designed to remove difficult flux and paste residues including lead-free, rosin, no-clean, and tacky flux, as well as other common electronic assembly residues.
New Equipment | Cleaning Equipment
Rapidly and effectively removes solder pastes, adhesives and flux residues. Completely air driven Misprint Cleaning System. Very simple and fast installation and operation. Board sizes up to 455 x 305mm - single vertical. Solder paste and flux re
New Equipment | Assembly Services
Rest assured in the quality of your production runs with Accu-sembly's IPC-610D certified hand solderers and inspectors, and electrostatic discharge (ESD) protected assembly floor. Our Thru-hole assembly process allows for your parts to be hand prepp
1.Modularized heating system. 2.Nitrogen protection system. 3.External high-power water-cooling system. 4.Flux Collecting system.
New Equipment | Assembly Services
Directly bonding to silicon and packaging materials typically requires the use of a flux or thin film metallization of the joining surfaces. SBT offers options for bonding to silicon, metal, ceramic and ceramic composite materials without metallizati
