Customer demand for highly sophisticated and ever smaller devices has made semiconductor packaging a vital contributor to system performance. As integrated circuits have become faster and more complex, the cost and performance of the interconnect bet
MLT provides laser services to remove unwanted squeeze-out from exposed metal pads, traces, and cavities. Squeeze-out can take the form of polyimide adhesives or prepreg resins. Whether a part of your standard manufacturing process or needed for re
Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
Left: This part looked ok to the naked eye. Right: A microscopic view shows evidence of this part being previously soldered or reworked. Another part caught and prevented from being a potential problem for our customer. Decapsulation, Pinpri
Design For Manufacturability And Yield Enhancement. The Design for Manufacturability (DFM) engine searches for fabrication issues and discovers areas where yields may be increased. GraphiCode's Contour Technology produces fast and accurate results f
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