New SMT Equipment: exposed thermal pad (Page 2 of 3)

Thermal Phase Change Pad

Thermal Phase Change Pad

New Equipment | Other

PCH-S15 Series thermally conductive interface materialsare applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base. Their flexibility and elasticity make them suited to the coating of the very uneven

WE GOT Electronic Co., Ltd

PADS® PCB Design Tools

PADS® PCB Design Tools

New Equipment | Software

A complete, but lower-cost PCB design solution for smaller organizations or individuals PADS®, Mentor Graphics’ world-leading desktop PCB design tool, enables you to develop PCBs within a highly productive, scalable, and easy-to-use environment.

Mentor Graphics

Thermogard® Label Materials

Thermogard® Label Materials

New Equipment | Reflow

Designed to exceed the harsh environment requirements that are seen in applications used in electronics, electrical, automotive and aerospace. All materials are thermal transfer printable and exhibit the highest PCS and first read rates.Each label

Polyonics, Inc.

NanoFoil® Multi-Layer Bonding Material

NanoFoil® Multi-Layer Bonding Material

New Equipment | Materials

NanoFoil® reactive multi-layer foil is a controllable and affordable bonding material, proven to lower manufacturing costs while providing repeatable and reliable bonds. NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for

Indium Corporation

Counterfeit Detection Services

Counterfeit Detection Services

New Equipment | Software

Left: This part looked ok to the naked eye. Right: A microscopic view shows evidence of this part being previously soldered or reworked. Another part caught and prevented from being a potential problem for our customer. Decapsulation, Pinpri

SolTec Electronics

UV-3010 UV Curable Conformal Coating / Encapsulant

UV-3010 UV Curable Conformal Coating / Encapsulant

New Equipment | Materials

Specifically engineered for water resistance on printed circuit board protection and LED component protection in membrane switches. Surface Resistivity: 3.8 x 1014 ω/■ Insulation resistance of cured films of UV-3010 at 100°C and 95% relative h

Conductive Compounds, Inc.

MEGARIDER™ Reflow Oven Analysis Test Boards

MEGARIDER™ Reflow Oven Analysis Test Boards

New Equipment | Reflow

The MEGARIDER™ family helps you to know more about the behavior of your oven. Use them to characterize for development, verify for production, or qualify pre-purchase. Equal masses across the width of the boards, permit PCB-like profiles that give in

Electronic Controls Design Inc. (ECD)

TTC100C - Lead Free Tip Tinner

TTC100C - Lead Free Tip Tinner

New Equipment | Solder Materials

Tip tinner to aid in cleaning and re-tinning solder iron tips de-wetted by use which can’t be repaired with sponge pads and cored solder wire. Use of TTC100C LEAD FREE Tip Tinner offers the following advantages: Lead Free SN100C tin/copper/nic

FCT ASSEMBLY, INC.

GC-PowerStation - Full CAM Package for PCB Fabrication

GC-PowerStation - Full CAM Package for PCB Fabrication

New Equipment | Software

Design For Manufacturability And Yield Enhancement. The Design for Manufacturability (DFM) engine searches for fabrication issues and discovers areas where yields may be increased. GraphiCode's Contour Technology produces fast and accurate results f

Graphicode

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

EP-1100 One-part Silver Conductive Epoxy for Screen or Stencil Printing

New Equipment | Materials

EP-1100 is a one-part adhesive epoxy designed for screen or stencil printing for component attachment, termination and other applications in: hybrid circuits membrane keypads other electromechanical assemblies EP-1100 exhibits excelle

Conductive Compounds, Inc.


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