Standard Silicone-Base Thermal Pads Qoolite – Cool Provide (SPVS) Flame resistant, high performance thermally conductive sheet Silicon Free Thermal Conductive Sheet Featuring Electromagnetic Wave Absorption Properties. High thermal conductiv
Our TGP110 thermal conductive adhesives is a series of reactive thermal grease with very thin BLT that eliminates micro-bubbles at the rough interface when applied. In service time, it can be cured to form thermal gel or thermal pad but with the perf
Thermal Pad: Qoolite™ Free CPVS Series: Silicone-based thermal pads are becoming an industry standard for thermal management solutions for their durability to withstand high temperatures up to 200°C. Intermark-USA offers a wide variety from 1.0 W/m*K
Thermal Pad (1.0W) IM711F – Ultra Soft Version Qoolite™ TH Soft Intermark-USA offers an extremely soft thermal pad (shore 00 5) at 1.0 W/m*K for applications that cannot take hardness ratings of shore 00 45-60. Silicone-based thermal pads are bec
Lite Fast SR-1000, a UV Solder Mask, was designed to screen print over conductive traces, landing pads, resistors, fuses and capacitors on Printed Circuit Boards (PCBs) and ceramic substrates. Other applications include metal and various plastics.
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RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban
We provide: Kapton tapes and dots, conformal coating tapes, high temp thermal transfer labels , thermal management pads, electrical insulators, custom fabricated gaskets and emi rfi shielding diecut parts. Please call (480) 968-6631
MLT provides laser services to remove unwanted squeeze-out from exposed metal pads, traces, and cavities. Squeeze-out can take the form of polyimide adhesives or prepreg resins. Whether a part of your standard manufacturing process or needed for re
ISL29020IROZ-T7A IC SENSOR LIGHT-DGTL I2C 6ODFN Optical Sensor Ambient 540nm I²C 6-WDFN Exposed Pad
M400 Series thermallyconductive interface materials are applied to fill the air gaps between the heatingelements and the heat dissipation fins or the metal base. Their flexibility andelasticity make them suited to the coating of the very uneven surfa