WISELY laser marking machine can work with most metal marking applications, such as Gold, Silver, Stainless Steel, Brass, Aluminium, Steel, Iron etc, and can also mark on many non-metal materials, such as ABS, Nylon, PES, PVC, Makrolon. Our machine
WISELY laser marking machine can work with most metal marking applications, such as Gold, Silver, Stainless Steel, Brass, Aluminium, Steel, Iron etc, and can also mark on many non-metal materials, such as ABS, Nylon, PES, PVC, Makrolon. Our machine
WISELY laser marking machine can work with most metal marking applications, such as Gold, Silver, Stainless Steel, Brass, Aluminium, Steel, Iron etc, and can also mark on many non-metal materials, such as ABS, Nylon, PES, PVC, Makrolon. Our machine
The latest evolution in FAYb laser markers, the LP-V10 features super high speed marking capability, more accurate marking, deeper marking and higher definition marking on tiny objects. �Ehigh speed 12 Watt FAYb laser, 710 characters per second outpu
Streamtek Electronis provides HHL Package with glass seal and ceramic seal for the applications of high power laser diodes Full solutions of HiRel Hermetic packages such HHL Package with Ceramic feedthrough; 2pin package with ceramic feedthrough; But
Aisin Seiki is expanding into new business areas such as femto second fiber laser and biotechnology related equipment. This creation of new values will promote new technologies and knowledge, which will be used in the manufacture of automotive compon
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
WISELY laser marking machine can work with most metal marking applications, such as Stainless Steel, Brass, Aluminium, etc, and can also mark on many non-metal materials, such as ABS, Nylon, PES, PVC, Makrolon. our machine: 1) High Precision: upto
The Laser Microjet is a technology that couples a laser beam into a thin water jet. The water jet is then used as a fiber optic wave guide to direct the beam to the wafer to be cut. The wafer is moved in the X and Y axis under computer control with p
Laser source with fiber outputs and average powers ranging from 10-200 Watts
