General Purpose (SMT): Chip Inductors and Ferrite Chip Beads
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Cal-Chip Electronics Inc is a leading manufacturer of surface mounted electronic devices. including ceramic capacitors, tantalum capacitors, and stacked PPS film capacitors. Resistors, such as thick and thin film chip resistors, and thick film chip r
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
S31803 Tubing Alloy S31803 is a 22% chromium, 3% molybdenum, 5-6% nickel, nitrogen alloyed duplex stainless steel with high general, localized, and stress corrosion resistance properties in addition to high strength and excellent impact toughness.
website:http://www.sanmega.net L size 1.6 ±0.15mm W size 0.8 ±0.15mm T size 0.8 ±0.15mm External terminal width e 0603 (1608)
Whatsapp+86 13425164065 Email: gluepotting@gmail.com We offer Power Shielded Inductors epoxy mixing dispenser We offer Unshielded Inductors epoxy potting machine We offer Coupled Inductors epoxy dispenser We offer Uncoupled Dual Inductor glue po
World's First Solder Joint Encapsulant Perfect solution for customers looking to eliminate underfilling processes. The SMT 256 Individual Solder Joint Encapsulation Adhesive is the world’s first combined flux gel/individual solder joint encapsulati
Gore offers a family of composite organic dielectric materials for chip package substrates and printed circuit boards. Manufactured in high volumes and supplied in standard sheet sizes, each product offers electrical properties, processing advantages
New Equipment | Test Equipment
X-5600 In-line/off-line X-ray inspection NDT system machine for LED, SMT, BGA, CSP, Flip Chip Inspection WhatsApp/wechat/Skype：+86 18779975930 Email: sales25@zhuomao.com.cn A Leader in the Intelligent x-ray Detection Equipment 14 years experience
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New Equipment | Test Equipment
X-6600 X-Ray Images Machine for Semiconductor, Packing components for Semiconductor, Packing components A Leader in the Intelligent x-ray Detection Equipment Application Field LED, SMT, BGA, CSP, Flip Chip Inspection Semiconductor, Packing compon
