Nordson ASYMTEK’s Fids-on-the-Fly™ option is up to 5.5X faster than the traditional stop-and-capture mode for locating fiducials. Reducing time spent performing this essential, non-dispense routine can increase UPH as much as 35 percent. Fiducials a
1) 120*130mm/1up, FR-4, Tg 135, CTI 175-225V 2) Dielectric constant(Er): 4.4-5.2 3) 2 layers, 1.6mm thick, 1 oz 4) Min. hole size: 0.3mm 5) Min. track/space: 4/4 mils 6) LPI Solder mask/White legend 7) Fiducial mark, tooling strips, mounting ho
The ScreenCut laser stencil cutting system features fast design file conversion and is compatible with Gerber, DFX and other format designs. Set-up and changeover for loose foil or frame mounted material is extremely fast as is throughput - up to an
High accuracy, high flexibility for 0201 (0.6mm x 0.3mm),SOIC,PLCC,BGA,,CSP,QFP (0.3mm pitch). Smart feeder ID system provide fast set up and easy programming. Suitable for small & medium volume production. Vision On the Fly Alignment system. Bot
Technical Innovation The first 10 bit image processing in its industry by on-the-fly vibrationless scan (High speed & high precision image acquisition) 4 times higher height measurement resolution than the existing Moire technology (The best
While bringing a fresh new look to the SP210avi the printer still retains it's reputation as the smallest printer in the market with the highest level of capability and quality. Developed as a flexible fine pitch Printer the SP210avi is ideal in
New Equipment | Solder Paste Stencils
SMD stencils from Multi-CB are manufactured using laser technology, which ensures a constant process quality through its high level of precision. Our SMD-Stencils fulfil the most stringent quality requirements with optimal register accuracy and cut
New Equipment | Solder Paste Stencils
DESEN Classic 1008 SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±25μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum
New Equipment | Solder Paste Stencils
DESEN Hito SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±18μm@,6σ Process Alignment Capability ≥2 Cpk@±8μm@,6σ Cycle Time 7s Maximum Print Area 400mm
New Equipment | Solder Paste Stencils
DESEN Navigator SPECIFICATIONS Process Parameters Specification Machine Alignment Capability ≥2 Cpk@±20μm@,6σ Process Alignment Capability ≥2 Cpk@±10μm@,6σ Cycle Time 7s Maximum Print Area 6
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