New Equipment | Solder Materials
Lead-free wave and selective soldering systems require exposing the flux to slightly higher soldering temperatures. Lead-free alloys traditionally wet metal surfaces more slowly than tin-lead. Kester liquid fluxes for lead-free assembly have new acti
New Equipment | Solder Materials
eFlux Selection: Rosin Based Flux for Lead-Free Wave Soldering NS-F850. NS-F850 ensures excellent wetting of all PCB and component substrates to deliver maximum through hole fill and facilitates the solder drainage that ensures minimum bridges an
BLIND RIVETS 'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surf
'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surfaces, gives hi
'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surfaces, gives hi
'REX' BLIND RIVETS, a range of high speed industrial fasteners are easily installed in blind or open applications, offer high clench, fill up over size holes, offer one length per dia-reducing stock holding, can be used on finished surfaces, gives hi
New Equipment | Soldering - Other
IPC J-STD 001 REV G Requirements for Soldered Electrical and Electronic Assemblies. The IPC J-STD-001F standard is the industry-consensus document with respect to the assembly of PCBs and electronic assemblies. Released October 2017. IPC J-ST
New Equipment | Fabrication Services
RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban
SIPAD Solid Solder Deposit (ssd) is a Siemens patented process that pre loads the pc board surface mount pads with solder in a solid form. Boards are printed, reflowed without components producing a predictable repeatable meniscus. SIPAD boards a
New Equipment | Assembly Services
Quick turn Prototype PCBs from 24 hour turnaround to high volume printed circuit board production from our domestic plant in USA and/or China facilities. Our Modern 38,000 sq. ft. manufacturing plant with multi-million dollar investment with latest e
