New Equipment | Fabrication Services
Aluminum PCB & Metal Core PCB & LED PCB Circuit board Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is refer to LED PCB board, which is the most important part of LED display and l
New Equipment | Assembly Services
Berks Plant Design & Maintenance used packaging equipment is available "as-is', rebuilt and reconditioned. Used packaging machinery is typically in good running condition or even like-new condition. Distinguished from rebuilt or reconditioned machine
Our conductive silicone gaskets are constructed from silicone containing metal powder fillers which combine to produce high levels of attenuation with excellent environmental shielding and a high level of conductivity. Many types of filler, from nick
Our AS Series of one-part conductive particle fill room temperature vulcanising (RTV) silicone rubber adhesives is available using standard silicone and flurosilicone base compounds combined with a selection of particle fillers to produce a readily e
Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to
Our DA150 series are solvent-free and fast cure thermosetting electrical and thermal conductive die attach adhesives. DA150 has excellent adhesion to the substrate and bare die. It can be used for small and large die attach. Both dispense and printin
100um) The second adhesive layer (AD) 170 ~ 250um The third layer of polyethylene (PE) 2.5 ~ 3.7mm 3 coal tar epoxy Coal tar epoxy structure: epoxy resin + filler made of coal tar pitch anticorrosive coating on the steel surface coated glass fa
Powder Coating- is a type of coating that is applied as a free-flowing, dry powder. The main difference between a conventional liquid paint and a powder coating is that the powder coating does not require a solvent to keep the binder and filler parts
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
170 oC) Phenolic cured (Dicy Free) system with inorganic filler High Td (decomposition temp. > 340 oC by TGA) Lead free process compatible (260 oC IR reflow 6x + 288 oC solder flow 3x, no delamination) Low Coefficient of Thermal Expansion ( 60 min. T
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