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Automatic SMT Splicing Machine BMM08G/G_Plus Functional advantages ▶Simple operation: 5 minutes to learn to operate, everyone can operate, reducing dependence on personnel. ▶Foolproof and error-proof: Automatically scan the code to compare and prev
General Purpose (SMT and Leaded Styles): Thick Film Chips and Arrays (SMT), NTC Chip Thermistors (SMT), Carbon Film (LD), Metal Film (LD), Metal Oxide Film (LD) and SIP Networks (LD)
RCX Series Resistors Versatile Wrap-Around Chip With resistance values from 1ohm to 1Teraohm, RCX Series resistors are ideal for a wide variety of applications. Wraparound terminations are perfect for epoxy or solder attachmen
Cermet Thick Film Materials, Au & Al Wire for Wirebonding, Flip Chip Underfills, Encapsulants, Potting Compounds, Paste & Film Adhesives, COB Die Attach, Solder Alternatives, Conformal Coatings, Vacuum Pick-up Tool, W/B Capallaries and Die Collets
The art of combination. . . the essence of thin film technology. Since 1980 Thin Film Technology has been designing and manufacturing thin film components in an ISO9001 certified operation. From this factory quality product serving the computer, test
RollPruf tri-polymer blend of neoprene, nitrile and natural rubber in 8 mil, hand specific design provides optimum comfort, reduced hand fatigue, with durability and strength uncommon to latex gloves. Applications: Chip Assembly Photomask Assembly Ph
Leading optoelectronics companies are looking to PROMEX for their outsource manufacturing needs. Our core competencies in microelectronics assembly technologies compliment our thorough understanding of high-speed circuit layout and process engineerin
Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha
Our LCDs are manufactured using COG (Chip On Glass), COB (Chip On Board), TAB (Tape Array Bonding) and COF (Chip On Flex) technology. From small graphic units suitable for cell phones to character modules for industrial use to larger TFTs (Thin Film
