Semiconductor Packaging Solutions - Component Inspection. The 850G XB modular AOI Inspection platform provides a range of advanced optic and handling solutions including 3D, high-resolution imaging and quad color lighting to provide the maximum def
New Equipment | Test Equipment
The standard range of products comprises mechanical and pneumatic test adapters for functional tests of assemblies and equipment. The comprehensive adapter system is characterized by very flexible fields of application. The test equipment is designed
New Equipment | Test Equipment
The ENGMATEC test handler is characterized by the wide-ranging spectrum of applications for in-circuit, functional or end tests. All components of the module system are matched with each other and can be combined with each other as well as with vario
DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b
DOCTAR is used validate design changes throughout the hardware board design and manufacturing lifecycle. DOCTAR analyzes changes to both to physical and logical elements in the design database. Test point analysis includes test points that have b
New Equipment | Cleaning Agents
KYZEN® E5321 is a room temperature pallet and maintenance cleaning agent. This cost effective chemistry removes all types of solder paste and flux residues, including baked on and hardened lead free high temperature flux residues from wave pallets an
New Equipment | Assembly Services
Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
New Equipment | Assembly Services
Factory supply cable utp cat5e and cat6 lan cable 305m (Rhonda(at)z-crown.com cable utp cat5e: 1.Conductor:24AWG,bare copper 0.51 +/-0.01 mm, 2.Insulation: High density polyethylene, minimum thickness of 0.19 mm 3.Conductor diameter 0.92 +/- 0
Manufacture: Goulds Model: 3196 XLT-X Size: 8×10-17 2000 gpm 67 ft HD 1200 rpm 13,875′ x 13′ Imp. Dia. Material: 316ss 50 hp motor Price: US $13,000.00
The objective of this course is to identify the technical issues in Through hole, SMT, BGA and fine pitch technology design and manufacturing that must be resolved for an effective implementation of mixed assembly electronics products. The course mat
