New Equipment | Selective Soldering
I.C.T-SS550 | Full-auto Online Selective Wave Soldering Machine Overview Selective wave soldering is a special form of wave soldering invented to meet the development requirements of through-hole components soldering. It is mainly suitable fo
New Equipment | Board Handling - Pallets,Carriers,Fixtures
BEST Inc. design and fabricates magnetic fixtures for ioT, flex and rigid-flex applications. Made frommagnetized steel, these fixtures are designed and fabricated to hold flat flex circuits. They can be used for pick and place, coating, depanelizing
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printing
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
New Equipment | Solder Paste Stencils
Based on its long work on BGA rework and repair process and its in-house capability to produce metal stencils BEST can provide for you a timely, cost-effective solution for printing on to components for MOST rework systems. Our templates for printin
Laser depanelization services from BEST Inc. feature precision cutting and depanelization cut out of flex and rigid flex materials. These materials a combination of Katon(TM), copper and rigid board material. After sending us the GERBER and cut out
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Solder Paste Stencils
These fixture plates facilitate the controlled dipping of flux or paste onto the balls under the BGA packages. Flux or paste is controlled at a depth of 50-60% per cent of the ball diameter prior to placement of a BGA or to place a PoP component on t
New Equipment | Solder Paste Stencils
Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o
New Equipment | Rework & Repair Equipment
Through-holes or vias can be damaged in the handling of PCB's or through the improper removal of a device. The BEST Through-hole Repair Kit can assist in the repair of these through-holes to make them look as good as new. BEST Through-hole repair ki
