High Precision Dispensers - MAX Series (Non-Heated) Max Series is capable of a wide variety of dispense applications including MicroVolume, Solder Paste and Conductive Adhesive, Underfill, Surface Mount Adhesive, Dam and Fill, Encapsulations, LED En
When Applications Require Large Board Processing &/or Versatility The DS Series of dispensers is a robust, large format platform designed to handle all types of applications with ease. Ideal for dispense applications utilizing adhesive, solder paste
FKN Systek K6000 - Fully automated singulation of up to 10 panels. Singulate Panels with up to 10 Scorelines. Process PCBs with Components up to 2.5" High. Integrated Input and Output Conveyors. Output Conveyor with Loaded Board Detector. Quic
New Equipment | Board Handling - Conveyors
Second-ranking double rack/gear adjustable wide organization, ensure transportation guide mutual parallel; > Machine adopts professional wear-resisting anti-static belts, special aluminum guide rail, ensure smooth shuttle smooth, transportation; >
FKN Systek K5000 - Manual board feed PCB multiple panel singulation Singulate panels with up to 10 scorelines. Singulate panels with components up to 2.5" 3 models available: - Output tray - Straight output conveyor - Right angle output
The FKN Systek K4000 motorized linear blade depanelizer is designed for high volume singulation of scored and skip scored Printed Circuit Boards. No programming necessary. (Switch select operating mode and speed) Singulate panels with components
S8, S10, S12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
E8, E10, E12 - 8, 10 or 12 top/bottom cooling zones. Heating System: Up to twelve groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air con
A500, A600, A800 - 5, 6 or 8 top/bottom cooling zones. Heating System: Up to eight groups of top and bottom forced hot air convection heating zones. Patented heating plates in each zone uniformly transfer heat to the PCBs using forced hot air co
Heller 1826 MK7 SMT Reflow Oven Heating Zones:Top 8 / Bottom 8PCB Width:50 - 560 mmWeight: 1970 kgDimension: W4650 x D1520 x H1440 mmProduct description: Heller 1826 MK7 SMT Reflow Oven, Heating Zones:Top 8 / Bottom 8, PCB Width:50 - 560 mm, Weight:
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