New Equipment | Fabrication Services
Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these
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New Equipment | Soldering Robots
Soldering Maching for Soldering Flex PCB to PCBA Boards,Dispenser Solder Paste to FPC then Soldering Feature: Applicable to different products, adjustable heating rate; Titanium alloy indenter ensures average temperature, fast heating rate and lo
New Equipment | Soldering Robots
Technical parameters: 1 Power supply: AC220V ± 10%, 50Hz, 3500W 2 Work environment :10-60 ℃, 40% ~ 95% 3 Working pressure: 0.5 ~ 0.7Mpa 4 Welding pressure: 2.5 ~ 28Kgf 5 Temperature settings: three sections (including start / separation)
UV PCB Laser Cutting Machine Application FPC and some relative materials; FPC/PCB/ Rigid-Flex PCB cutting, Camera module cutting; UV PCB Laser Cutting Machine Parameter Parameter
New Equipment | Soldering Robots
Benchtop Hot Bar Soldering Machine PCB Soldering Process For Flex Boards Microprocessor-based controller provides precise and consistent temperature control. Unique pulsed heat thermode offers uniform temperature distribution, fast heating and c
Ersa HOTFLOW 4/20 Reflow Oven Working width: 45-560 mm Process length: 5,920 mm Heated length: 3,805 mm Cooling length: 2,115 mm Weight appr. 2,600 kg Dimension: 6,600x1,410x1,350 mm Ersa HOTFLOW 4/20 Reflow Oven Ersa HOTFLOW 4/20 Reflow Oven
Ersa HOTFLOW 4/14 Reflow Oven Working width: 45-560 mmProcess length: 4,400 mmHeated length: 2,665 mmCooling length: 1,735 mmWeight appr. 2,000 kgdimension: 5,030x1,410x1,350 mm Ersa HOTFLOW 4/14 Reflow Oven Ersa HOTFLOW 4/14 Reflow Oven Refl
New Equipment | Education/Training
IPC standards, the results of industry consensus and collaboration, are respected throughout the whole world. Using IPC standards allows manufacturers, customers and suppliers to speak the same language. IPC standards are used by the electronics
The demand for small, hand-held electronics with more features is driving smaller, thinner, and more dense flex and rigid printed circuit boards (PCBs). Depaneling, or the laser singulation of printed circuit boards, offers numerous advantages to a
Ersa HOTFLOW 4/8 Reflow Oven Working width: 45-560 mm Process Length: 3,260 mm Length Heated: 1,525 mm Length Cooled: 1,735 mm Weight app. 1,100 kg Dimension: 3,905x1,410x1,350 mm Ersa HOTFLOW 4/8 Reflow Oven Ersa HOTFLOW 4/8 Reflow Oven High
