New SMT Equipment: flex delamination (Page 1 of 1)

355nm Laser Depaneling Machine Printed Circuit Board UV Cutting Machine

355nm Laser Depaneling Machine Printed Circuit Board UV Cutting Machine

New Equipment | Depaneling

The demand for small, hand-held electronics with more features is driving smaller, thinner, and more dense flex and rigid printed circuit boards (PCBs). Depaneling, or the laser singulation of printed circuit boards, offers numerous advantages to a

ChuangWei Electronic Equipment Manufactory Ltd.

Optowave 355nm PCB Laser Depaneling Machine with No Pressure PCB Cutting

Optowave 355nm PCB Laser Depaneling Machine with No Pressure PCB Cutting

New Equipment | Depaneling

Laser Depaneling Machine Features: Non-contact cutting process to eliminate stress to the PCB and its delicate components Reduced micro-cracks and reduced delamination for longer PCB life Greater flexibility to cut unusual shapes Faster set up

ChuangWei Electronic Equipment Manufactory Ltd.

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