New SMT Equipment: flip chip technology[0] (Page 1 of 11)

DJ-2200 DispenseJet Non-Contact Flux Jet

DJ-2200 DispenseJet Non-Contact Flux Jet

New Equipment | Dispensing

Flux application using the DispenseJet® pump is a superior alternative to screen printing and ultrasonic spray. Jet dispensing eliminates the overspray and material waste associated with ultrasonic and spray application methods. Flux application usi

ASYMTEK Products | Nordson Electronics Solutions

Spectrum II S2-900 Series Fluid Dispensers

Spectrum II S2-900 Series Fluid Dispensers

New Equipment | Dispensing

The world-class precision and quality Spectrum® II system for assembly of mobile electronics, semiconductors, MEMS, and PCBs High Speed, High Accuracy, Precision Dispensing System. Higher consistency leads to higher yield and maximum profitability

ASYMTEK Products | Nordson Electronics Solutions

DJ-9500 DispenseJet High-Speed Jet Dispensing

DJ-9500 DispenseJet High-Speed Jet Dispensing

New Equipment | Dispensing

The DispenseJet DJ-9500 supports a long list of jettable fluids for a wide range of applications. Incorporating over 15 years of jetting experience, the DJ-9500 jet provides even more capability than its DJ-9000 predecessor. Nordson ASYMTEK's jettin

ASYMTEK Products | Nordson Electronics Solutions

Underfill Encapsulants for Flip Chips

Underfill Encapsulants for Flip Chips

New Equipment | Materials

Zymet's underfill encapsulants for flip chips are designed to enhance the thermal cycle performance. They incorporate silica filler, used to reduce the encapsulant’s CTE, that are highly engineered in both morphology and particle size distribution to

Zymet, Inc

Chip Attenuators

Chip Attenuators

New Equipment | Components

Since 1977, Barry Industries has manufactured the highest quality chip attenuators available. All chip attenuators are designed and manufactured in our 40,000 square foot facility in Attleboro, Massachusetts USA. Vertical Integration is our key to en

Barry Industries, Inc.

Accuspec

New Equipment |  

Precision measurement tool kit for accurracy, repeatabilities, assessment of Chip Shooter, IC Placer, Mechanical and Semi Automatic Flip Chip machine

TECH SOLUTION MARKETING

SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform

SIPLACE CA Series - Chip Assembly and SMT Placement on a single platform

New Equipment | Pick & Place

Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production

ASM Assembly Systems GmbH & Co. KG

Non-Conductive Pastes (NCP)

Non-Conductive Pastes (NCP)

New Equipment | Materials

For flip chip attachment of RFID and smartcard IC’s Zymet's NCP’s are designed for flip chip attachment of gold bumped IC’s. Although they are specifically designed for RFID and smartcard assembly they can also be used for other flip chip applicati

Zymet, Inc

NxGenElectronics.com

NxGenElectronics.com

New Equipment |  

Aluminum Wirebonding Gold Wirebonding Gold Ribbonbonding Wafer Bumping Flip Chip Packaging BGA LGA SMT Direct Chip Attach System In Package Hybrid MCM Stacked Die 3D Packaging 3D Memory Rad Hard RF Packaging

NxgenElectronics

  1 2 3 4 5 6 7 8 9 10 Next

flip chip technology[0] searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

Software for SMT placement & AOI - Free Download.
SMT spare parts - Qinyi Electronics

High Precision Fluid Dispensers
Thermal Interface Material Dispensing

World's Best Reflow Oven Customizable for Unique Applications
design with ease with Win Source obselete parts and supplies

Internet marketing services for manufacturing companies