ProntoVIEW-MARKUP is assembly CAD Viewer & Gerber Viewer software used by electronics manufacturers to quickly find components, pin, shorts between traces, etc. ProntoVIEW-MARKUP is also a redline tool that allows annotation of the assembly to creat
New Equipment | Test Equipment
KOH YOUNG Zenith UHS 3D AOI Camera: 12M 15um Max PCB: 490 x 510 mm Weight: 600kg Dimension: 820x1265x1627 mm KOH YOUNG Zenith UHS 3D AOI KOH YOUNG Zenith UHS 3D AOI A model with 8 projections and an 8MPx camera. This model is very resistant t
New Equipment | Board Handling - Conveyors
Inverts (flips) Printed Circuit Assemblies upside down for bottom side processing. SMEMA Compatible, touchscreen control, 450mm maximum conveyor width. Two models to choose from. The Anda PCB Inverter / Flipper is a compact inverting module for use
New Equipment | Board Handling - Conveyors
Bi-directional board inverter Programmable board flow sequence Pass-through function Bi-directional Light tower as status indicator The Board Inverter turns the board upside down to make mounting possible on the secondary side wit
New Equipment | Wave Soldering
Flat Linear Induction Pump (FLIP) solder bath : True Lead-free enabler : Less maintenance Tamura Wave Advantages: No moving parts inside solder bath minimizes oxides in solder bath 40% less solder dross generated than conventional motor dr
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
A multi-purpose bonder, offers high placement accuracy (5 micron), allowing for bonding of the smallest die with a pitch of down to 50 µm. This versatile platform is used in a wide field of micro assembly applications – such as flip chip and die bon
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
Majelac Technologies provides subcontract assembly services to the semiconductor & optoelectronic industries. We specialize in Quick Turn Assembly & Packaging of Ball Grid Array packages and can handle a large variety of other package types.�Majela
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