New Equipment | Test Equipment - Bond Testers
feature • 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function intensifier with±60° tilt imitat
New Equipment | Test Equipment - Bond Testers
• 100~130kV 5µm closed X-ray tube, high sensitive image intensifier with 200M mega pixels CCD camera • Multi-function workstation with±70° tilt and X-Y-Z-Q-M multi-axis movement and CNC auto-detect &bu
Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc. Application Fields SMT/PCBA Semiconductor Lith
YINCAE’s Fully Flux Residue Compatible Underfill: UF 158HA (Albany, NY) August 15, 2022 YINCAE is excited to announce that we have developed UF 158HA that is fully compatible with flux residue and high performance underfill.
Bonding forces up to 700 N with outstanding coplanarity. As the versatile FINEPLACER® pico ma system continues to evolve, a new optional configuration has been developed for the latest Anisotropic Conductive Film (ACF) applications. Today's ACF cha
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
Welwyn Components� new SMT facility contains the latest manufacturing techniques for both standard and specialist chip resistors. These include high speed/ high precision printing and lasering equipment, grading and tape packing machines and a state
Advanced semiconductor packaging and high precision SMT assembly convergence. Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced techno
130kV, 5 Micron Microfocus X-Ray Inspection System The X-SCOPE 6000 is digitally full programmable CNC controlled x-ray inspection system that allows operators to program inspection and measurement routines with point and click ease. Standard featu
Automated Prototype2Production Bonder. The FINEPLACER® femto 2 is a fully-automated die bonder with a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Fully protecte
