Precision measurement tool kit for accurracy, repeatabilities, assessment of Chip Shooter, IC Placer, Mechanical and Semi Automatic Flip Chip machine
Performs pick and place, component placement, adhesive dispense, and flip chip operations.
Turn-key xray systems for BGA, FlipChip and solder analysis
Flux in-line Solder Flux Inspection and Measurement System process control tool for BGA, CSP and flip chip component manufacturing
The CRX-Series of real time, high resolution x-ray inspection systems for PCBs and components including BGAs, bond wire and flip chip, providing yield improvement solutions for the printed circuit board assembly and advanced semiconductor-packaging i
The CRX-Series of real time, high resolution x-ray inspection systems for PCBs and components including BGAs, bond wire and flip chip, providing yield improvement solutions for the printed circuit board assembly and advanced semiconductor-packaging i
For Solder Jet Bonding – SJB / Flip-Chip
New Equipment | Assembly Services
Packaging System for Semiconductor and Electronic Device Flip Chip Bonder is an equipment used in the semiconductor packaging process. It is a method of connecting individual chips of wafers so that the bumps on the chip and electrodes of the substr
Yamaha Flip Chip Bonder & Hybrid Placer High-Accuracy ±5?m High-Quality & Flexibility Weight:3,600kg simultaneous transfer :13,000 UPH Product description: Yamaha Flip Chip Bonde,Hybrid Placer, Yamaha flip chip bonding,Yamaha die bond, Yamaha
Chip assembly? Classic SMT placement? Our SIPLACE CA can do both. The SIPLACE CA is the world's first placement platform that combines bare-die placement directly from the wafer and classic SMT placement in a single machine and a single production
