New Equipment | Assembly Services
PCB Assembly HuanYu Future provides consigned assembly services for electronics manufacturers in small volume NPI format. We have procured seven lines of extremely high end SMT chipshooters, and with our own advanced management system, we build
New Equipment | Education/Training
The Component Identification Training & Reference Guide is a valuable tool for employee training and quick reference. This comprehensive component identification resource for electronics assembly operators and inspectors contains color photographs, c
SMT 256B series dip adhesives have been designed to enhance solder joint reliability and eliminate solder joint cracking for CSP, BGA, Flip chip and PoP (package on package), particularly for lead free application. SMT 256B is a kind of polymer adhes
SMT266 offers all the features and advantages of our SMT256 series, in a convenient jetting adhesive form (and can also be brushed on during rework). SMT 266 series spray adhesives have been designed to enhance solder joint reliability and eliminat
New Equipment | Solder Materials
Big-Size Vacuum Soldering Oven for IGBT, MOS 1.Reflow soldering Typically high number of voids cause a large non conductive area 2.Vacuum soldering Very low number of voids, Typically 3.Applications Power Semiconductors;Hybrid
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
New Equipment | Soldering - Other
Sunny Company:Beijing Chengliankaida Technology Co.,Ltd Address : SanCang Road Sanjianfang airport ,Tongzhou district , Beijing China Email: salemachines@bjclkdkj.cn Skype :smdsupplier Whatsapp: +86 159 01434496 Wechat: + 86 159 0143 4496
New Equipment | Cleaning Equipment
Austin American Technology’s Mega SA® cleaning system is designed for primary defluxing and final cleaning prior to sealing. It uses semi-aqueous chemistries requiring a water rinse. The Mega SA® is compatible with Terpenes, and petroleum-based solve
New Equipment | Cleaning Equipment
Plasma Cleaner Low pressure plasma cleaner system can be used on all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning. Application: LCM, IC Packaging (Flip Chip, CSP, BGA, L
New Equipment | Cleaning Equipment
Plasma Cleaner Low pressure plasma cleaner system can modify all kinds of printing or adhesive substrates prior to surface activation, modification, grafting, roughening or cleaning. Application: LCM, IC Packaging (Flip Chip, CSP, BGA, Lead F
